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SEMI-SOLID PHOTORECEPTOR SUBSTRATE

IP.com Disclosure Number: IPCOM000027834D
Original Publication Date: 2000-Feb-29
Included in the Prior Art Database: 2004-Apr-09

Publishing Venue

Xerox Disclosure Journal

Abstract

Disclosed is a semi-solid substrate for photoconductive members employed in electrophotographic printing machines. The semi-solid substrate solves problems associated with thin walled and thick walled extrusions where the ends are chamfered and bored simultaneously to insure proper length, freedom of burrs, and other irregularities. The semi-solid substrate utilizes a solid extrusion, counterbored or deep bored when required to shape and length dimensions large enough to accommodate material handling and flanges. Remaining stock left in place provides necessary weight required for motion control and eliminates noise. The extra weight facilitates using more aggressive (quicker) grinding and the beam strength needed to resist deflection during lathing. Additionally, there would be no porthole weld lines to contend with.