Dismiss
The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Chip Cooling and Thermal Contacting

IP.com Disclosure Number: IPCOM000028033D
Original Publication Date: 2004-Apr-21
Included in the Prior Art Database: 2004-Apr-21

Publishing Venue

IBM

Abstract

The disclosed idea relates to a protective layer of boron nitride (BN) between a Si surface and a liquid metal, e.g. Ga or Ga-alloys, for chip cooling.