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Chip Cooling and Thermal Contacting

IP.com Disclosure Number: IPCOM000028033D
Original Publication Date: 2004-Apr-21
Included in the Prior Art Database: 2004-Apr-21

Publishing Venue



The disclosed idea relates to a protective layer of boron nitride (BN) between a Si surface and a liquid metal, e.g. Ga or Ga-alloys, for chip cooling.