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Disclosed is a method that enables multiple paste types to be printed onto a substrate with only one printing instance. Benefits include improving productivity by eliminating process steps.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
100% of the total text.
One-Time Printing of Multiple Types of
Solder Paste on Substrate Panels
Disclosed is a method that enables multiple paste types to
be printed onto a substrate with only one printing instance. Benefits include
improving productivity by eliminating process steps.
Currently, substrate suppliers use multiple processes and
machines to solder print various types of solder paste (see Figure 1). For example, if a supplier prints Regular
Leaded Solder Paste on the C4 bump area of the substrate, and prints Lead Free
solder paste on the chip cap pads of the same substrate, the supplier uses one
machine and stencil for the first step, then uses another machine, stencil, and
solder paste for the second step.
The disclosed method enables multiple paste types to be
printed onto a substrate with only one printing instance (see Figure 2). The
disclosed method ensures that the solder pads of similar paste types do not
overlap in the direction of the paste printing. It also compartmentalizes the
stencils with separate “drains” for the various solder paste types, and has
specially designed squeegees that fit within the new stencil “drains” (see
Figure 3). The walls of the “drain” and squeegee design prevent the solder
paste of one drain from spilling over into the next.
The disclosed method improves productivity by eliminating
process steps (i.e. uses a single machine to carry out multiple steps).