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Disclosed is a method that uses crystalline substances to detect package overheating; the crystalline substances change appearance when the package reaches or passes the maximum allowable temperature.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
67% of the total text.
Crystalline Substances Coating for BGA
Package Overheating Detection
Disclosed is a method that uses crystalline substances to
detect package overheating; the crystalline substances change appearance when
the package reaches or passes the maximum allowable temperature.
Electronic components are sensitive to maximum temperatures in
the solder reflow process or rework process in motherboard manufacturing. High temperatures can significantly degrade the
BGA package first-level interconnect, and can cause the BGA package to prematurely
fail in a computer system. Additionally, the substrate of the BGA package can
delaminate if overheated. These
failure modes are well known, however a detection device for the BGA component
does not exist for these conditions. This makes failure analysis difficult or
impossible, making Intel liable for out-of-specifications conditions at the
board manufacturing factory.
The disclosed method uses liquid crystals to detect any
out-of-specification package processing, specifically due to overheating either
during the in-line reflow soldering process or during rework. Liquid crystals
have the qualities of crystalline solids and isotropic liquids: in different
states they either flow like liquids or appear like solid crystals. Heating a
crystal to a critical temperature changes the crystal from one structure to
another. Changing the crystalline structure usually changes many physical
properties of crystals, such as density...