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Detecting BGA Package Overheating and Re-Balling

IP.com Disclosure Number: IPCOM000028050D
Publication Date: 2004-Apr-21

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a hybrid "sacrificial" solder ball (i.e. one that is not used for I/O or power delivery) to detect BGA package overheating and solder re-balling.