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Integrated mini heat-sink as heat channel in PCB Disclosure Number: IPCOM000028082D
Publication Date: 2004-Apr-22
Document File: 1 page(s) / 51K

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The Prior Art Database



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Integrated mini heat-sink as heat channel in PCB

    In many printed circuit boards, via's are used to transfer heat from components to a copper layer to another. A drawback of this is that, when the components placed on the PCB are big or produce a lot of heat,

    Many via's and a large PCB surface are necessary to realize effective cooling. It has been found, however, that effective cooling can be realized by filling up holes in the PCB with copper and/or with plastics that are good heat conductors.

Disclosed anonymously.