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Method and Apparatus for System Test Optimization using Thermal Feedback

IP.com Disclosure Number: IPCOM000028208D
Original Publication Date: 2004-May-03
Included in the Prior Art Database: 2004-May-03

Publishing Venue

IBM

Abstract

This article describes a method of linking a test program with a datalogger in such a manner that the program can generate a thermal snapshot of the system. This data allows the test program to automatically adjust its operations so that it can optimally stress the system under test. In addition, the linkage allows the test to profile which operations stress which parts of the system most so that a more accurate view of the system environment can be made.