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Method for soft metal interconnects and sockets with metal features and/or Cu tapers for FCBGA or FCLGA package and MB assembly

IP.com Disclosure Number: IPCOM000029126D
Publication Date: 2004-Jun-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for soft metal interconnects and sockets with metal features and/or Cu tapers for flip-chip ball-grid array (FCBGA) or flip-chip land-grid array (FCLGA) package and motherboard (MB) assembly. Benefits include improved functionality, improved performance, improved environmental friendliness, improved ease of implementation, improved process simplification, and improved support for future technology.