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Disclosed is a method which pads semi-sphere pin into an enlarged Printed Circuit Board (PCB) via hole; to enhance soldering, the pins are used as pads for the Ball Grid Array (BGA).
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
96% of the total text.
Printed Circuit Board Via with Padded
Semi-Sphere Pin for BGA Solder Improvements
Disclosed is a method which pads semi-sphere pin into an
enlarged Printed Circuit Board (PCB) via hole; to enhance soldering, the pins
are used as pads for the Ball Grid Array (BGA).
Currently, solder joint defects (i.e. opens and cracks) are
a common problem at the BGA device. To remedy this problem, improvements have
been made to the front-end of the manufacturing process, and test fixture
design rules have been included at the back-end of the process; these measures
help reduce the risk of BGA opens and cracks.
The BGA package is mounted onto the solder pad on the PCB, which
provides continuity between the BGA ball and the PCB (see Figure 1). Mounting
the BGA package in this way forms a solder joint between the BGA ball and the PCB
(see Figure 2).
In the disclosed method, the solder pad is no longer needed;
it is replaced by semi-sphere pins. The
semi-sphere pins are padded into the enlarged PCB via holes during the PCB
fabrication process (see Figure 3). Figure 4 shows the BGA package mounted onto
the semi-sphere pins on the PCB, where the BGA ball forms a solder joint with
The following are advantages of the disclosed method:
Simplifies PCB routing and maximizes usage of the PCB
Increases the area of contact between the BGA ball and the
PCB, thereby improving solder joint strength and reliability