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Printed Circuit Board Via with Padded Semi-Sphere Pin for BGA Solder Improvements

IP.com Disclosure Number: IPCOM000029151D
Publication Date: 2004-Jun-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method which pads semi-sphere pin into an enlarged Printed Circuit Board (PCB) via hole; to enhance soldering, the pins are used as pads for the Ball Grid Array (BGA).