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Automatic Wafer Backside Inspection

IP.com Disclosure Number: IPCOM000029473D
Original Publication Date: 2004-Jul-25
Included in the Prior Art Database: 2004-Jul-25

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Siemens

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Abstract

In semiconductor industries wafers are processed/handled in vacuum. While clamping wafers on various chucks (e.g. pinset, plates, waferchuck etc.) vacuum problems or contamination can occur. Due to vacuum problems the processed wafer can break and/or a tool-down-situation may happen. In this case manual wafer handling might be necessary. Contamination or scratches on the wafer surface can also cause misplacement of the wafer on plates or wafer-chunk (local unflatness) leading to miss-processing and/or yield loss. While using offline inspection (manual handling) not all wafers at all litho-operations can be measured (sampling). Inspection is done after the litho-process.