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Copper Piping System For Under-raised-floor Connections Between Cooling Distribution Unit and Mainframe Computers Disclosure Number: IPCOM000029549D
Original Publication Date: 2004-Jul-06
Included in the Prior Art Database: 2004-Jul-06
Document File: 1 page(s) / 48K

Publishing Venue



The invention provides a means of installing and testing an assembly of copper piping sections that constitute a water-carrying hose for connecting a water-cooled computer to a computer room water conditioner (CRWC). The hose is cost-effective, easy to transport and install, and reliable.

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Copper Piping System For Under -raised-floor Connections Between Cooling Distribution Unit and Mainframe Computers

The invention constitutes a pipe-building kit that facilitates assembly of a customized water piping system to connect water-cooled mainframes to remotely placed compputer room water conditioner (CRWC) units. Each connection between a water-cooled mainframe and a CRWC is comprised of an assembly of pipe sections constituting a water feed and a return path. The paths are formed from assemblies of short pipe sections, typically 6-feet long. Each pipe section is terminated with flanges that faciliate leak-proof mating of pipe sections. The leak-proof feature is obtained by using flange connections with redundant O-rings, as shown in the figure. One end of the piping assembly is connected to the CRWC, and the other end to the mainframe. The ends are suitably terminated to provide convenient and reliable connections. The pipe kit consists of mostly 6-feet long pipe sections. To be able to connect a mainframe and a CRWC that are not spaced in exact multiples of 6 feet, shorter pipe sections can also be included in the kit. Shorter pipe sections can be 1, 2, 3, 4 and 5 feet long. In addition, an assortment of short, bent pipe sections can be included to facilitate bends in the piping assemblies. Once installed a piping assembly can be checked for water tightness by providing a Schrader value to pressurize the assembly and then measure the pressure decay as...