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A Gap on a Stage Holding the Wafer Introduces a Non-Uniformity During the Annealing of Wafers

IP.com Disclosure Number: IPCOM000030141D
Publication Date: 2004-Jul-29
Document File: 2 page(s) / 67K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that eliminates the notch or gap in the chuck; this notch or gap can introduce non-uniformities for the annealing of a wafer.