Dismiss
InnovationQ and the IP.com Prior Art Database will be updated on Sunday, December 15, from 11am-2pm ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Passivating Exposed Copper Surfaces Between Bonded Wafers or Dice Using ALD

IP.com Disclosure Number: IPCOM000030142D
Publication Date: 2004-Jul-29

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses ALD (atomic layer deposition) to deposit film between bonded wafers or dice to stop the copper from corroding and diffusing. Benefits include a solution that speeds vapor diffusion and eliminates potential shorting and leakage problems associated with metal passivation layers.