Passivating Exposed Copper Surfaces Between Bonded Wafers or Dice Using ALD
Publication Date: 2004-Jul-29
The IP.com Prior Art Database
Disclosed is a method that uses ALD (atomic layer deposition) to deposit film between bonded wafers or dice to stop the copper from corroding and diffusing. Benefits include a solution that speeds vapor diffusion and eliminates potential shorting and leakage problems associated with metal passivation layers.