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Passivating Exposed Copper Surfaces Between Bonded Wafers or Dice Using ALD

IP.com Disclosure Number: IPCOM000030142D
Publication Date: 2004-Jul-29

Publishing Venue

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Disclosed is a method that uses ALD (atomic layer deposition) to deposit film between bonded wafers or dice to stop the copper from corroding and diffusing. Benefits include a solution that speeds vapor diffusion and eliminates potential shorting and leakage problems associated with metal passivation layers.