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Selectively Depositing Noble Metals on Thick Copper Layers

IP.com Disclosure Number: IPCOM000030143D
Publication Date: 2004-Jul-29
Document File: 2 page(s) / 48K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that selectively deposits noble metals (such as Ag, Au etc.) on thick copper structures to increase the oxidation resistance of copper and to reduce copper electro-migration with minimum resistance impact.