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A DC Electron Plasma for the Sealing of Porous Low-Dielectric Constant ILD Materials

IP.com Disclosure Number: IPCOM000030144D
Publication Date: 2004-Jul-29

Publishing Venue

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Abstract

Disclosed is a method that uses a DC electron plasma (in the presence of a radical reactive species) to stimulate reactions from ILD (inter-layer dielectric) surfaces and seal porous low-dielectric constant materials. Benefits include a solution that is less expensive and eliminates ion bombardment damage.