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Interleaved Fin Heat Sink for DIMMs

IP.com Disclosure Number: IPCOM000030643D
Original Publication Date: 2004-Aug-20
Included in the Prior Art Database: 2004-Aug-20

Publishing Venue

IBM

Abstract

Computer memory subsystems are increasing in density and speed while computer enclosure sizes keep getting smaller for the same number of components; everything contributing to an increasing thermal challenge. Previously, a system with multiple DIMMS needed no direct cooling but, recently, designs have been challenged in the ability to sufficiently cool the memory subsystem. Current solutions to this problem include increasing the air flow with more fans or more expensive fans or limiting the number of DIMMS in the system. Modern chipsets help distribute this heat load among the populated DIMMS such that they all run cooler. However, a problem occurs when not all of the DIMMS are populated. In fact, the thermal problem at the memory level gets worse with fewer DIMMS, not better even though at the system level there is less total heat.