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Conductive Hot Melt Adhesive in Commercially Available Dispensing Form Factor for Electron Microscopy

IP.com Disclosure Number: IPCOM000030757D
Original Publication Date: 2004-Aug-25
Included in the Prior Art Database: 2004-Aug-25

Publishing Venue

IBM

Abstract

An easy, inexpensive, no delay, method of placing and bonding samples for examination in a scanning electron microscope (SEM) using a electrically conductive hot melt adhesive.