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Apparatus and Program for Measuring Thermal Interface Material Thickness Using High Pulsed Ultrasonic Waves

IP.com Disclosure Number: IPCOM000031046D
Original Publication Date: 2004-Sep-08
Included in the Prior Art Database: 2004-Sep-08

Publishing Venue

IBM

Abstract

An apparatus and program are described to calculate thermal interface material thickness using ultrasonic waves. It has been shown that this method can be performed in dynamic and static mode.