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Method of interconnecting a vertical transistor chip in direct chip attachment (DCA) technology using a copper clip Disclosure Number: IPCOM000031165D
Original Publication Date: 2004-Sep-15
Included in the Prior Art Database: 2004-Sep-15

Publishing Venue


Related People

Robert Bauer Torsten Hauck Anton Kolbeck


Abstract Vertical transistor chips provide source, drain, gate and sense signal contacts on opposite chip sides. Direct chip attachment (DCA) of such a transistor chip on a carrier requires appropriate methods in order to establish electrical and/or thermal connection to chip front side and chip backside. Existing standard technologies such as flip chip or other DCA methodologies can be used for the chip front side connection. This document describes a new, reliable and cost competitive way of establishing a chip backside connection, meeting harsh automotive qualification requirements. The method introduced by this document is based on the application of a copper clip with a special design, which is soldered or glued to the chip backside and carrier surface.