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Heat Dissipation Unit for Multi-Processor Arrays using Power Sharing Technology Disclosure Number: IPCOM000031472D
Original Publication Date: 2004-Sep-27
Included in the Prior Art Database: 2004-Sep-27
Document File: 1 page(s) / 31K

Publishing Venue



Processor thermal specifications are beginning to drive the industry into the realm of liquid cooling, increasing the cost of the thermal solution, development complexity, as well as the risk of catastrophic failures. This invention solves many issues associated with the restricted thermal envelopes that we are dealing with in today's environment such as: 1) Thermal Specifications - Gives air-side cooling greater longevity over traditional solutions. 2) Acoustics - Power sharing technology reduces acoustic levels in all environments and power levels over traditional solutions. 3) Power Sharing Utility - Gives the manufacturer the ability to reduce thermal design targets at much lower risk.

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Heat Dissipation Unit for Multi-Processor Arrays using Power Sharing Technology

    Use one heat dissipation unit capturing two or more high power processors (in this case, the heatsink will dissipate heat from 2 Intel Xeon processors)

1) Air-side cooling longevity increased.
2) Reduced performance loss potential.
3) Acoustical savings. 2 Main Claims:
The use of a larger heatsink that incorporates a homogeneous base in contact with two chips rather than separate heatsinks allows effective utilization of volume that before could not be used between two separate heatsinks. Surface area can be increase anywhere from 10-25+% (depending on pitch of CPUs). Cooling performance will then increase 5-20+%.

Takes advantage of DP (Dual-Processor) usage models:

    Thermal design criteria have always been worse case scenarios. Worse case meaning maximum environment (including elevation), worse case silicon (high dynamic/leakage currents), and worse case application power draws (power viruses). The third worse case criteria has often been criticized because we have never seen an application that draws more than 60-70% of Intel's rated design power specification. Therefore, in a UP (Uni-Processor) system, we often debate worst case environments. If UP systems are criticized for designing to worse case scenarios, then the probability of DP's reaching worse case conditions is that much more unlikely. This is where the concept makes an impact in thermal solution design.

    The base...