Heat Dissipation Unit for Multi-Processor Arrays using Power Sharing Technology
Original Publication Date: 2004-Sep-27
Included in the Prior Art Database: 2004-Sep-27
Processor thermal specifications are beginning to drive the industry into the realm of liquid cooling, increasing the cost of the thermal solution, development complexity, as well as the risk of catastrophic failures. This invention solves many issues associated with the restricted thermal envelopes that we are dealing with in today's environment such as: 1) Thermal Specifications - Gives air-side cooling greater longevity over traditional solutions. 2) Acoustics - Power sharing technology reduces acoustic levels in all environments and power levels over traditional solutions. 3) Power Sharing Utility - Gives the manufacturer the ability to reduce thermal design targets at much lower risk.