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Flexible Electrically Conductive EMI Envelope Enclosure for Printed Circuit Cards

IP.com Disclosure Number: IPCOM000031489D
Original Publication Date: 2004-Sep-27
Included in the Prior Art Database: 2004-Sep-27

Publishing Venue

IBM

Abstract

Construction of Electromagnetic (EMC) and electrostatic discharge (ESD) enclosures for computing equipment encounters various problems due to effectiveness against electromagnetic radiation, ease-of-implementation, and increased manufacturing and bill of material costs. These problems are compounded for small form factors found in mobile computing devices. The available space within the plastic enclosure leaves little room to form a tight fitting rigid metal shield (such as stainless steel). Other electrically conductive plating methods such as copper spray represent environmental hazards. The solution to these problems is a novel enclosure that is flexible, conforms to the dimension of a printed circuit board (PCB), and completely seals the PCB with no slot openings or gaps in electrical conductivity.