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A reference plane providing a current return path for high-speed signals may have openings which cause return path deviations. A return path bridge as described here could be constructed to minimize this return path deviation.
English (United States)
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Method and Structure to Bridge Current Return Path Discontinuities on Adjacent
Reference Planes Within an Electronic Package
Electronic packages containing high-speed signalling typically provide reference planes
in close proximity to signal traces. The signal return path normally follows the nearest
portion of the adjacent reference plane or planes. A return path discontinuity occurs
whenever the reference plane shape changes along the path of the signal trace. Many
features inside an electronic package, such as vias, pads, voltage splits, and the
corresponding openings associated with any of these items, may cause return path
discontinuities. The current method to check for and minimize these return path
discontinuities is through a visual or automated inspection of the design and
modification of the wiring to minimize the effects of the discontinuity. The drawback of
this method becomes apparent when the wiring constraints limit the length of the wire
and any modifications to the wire will violate these constraints. A method and structure
is need that preserves the wiring constraints and minimizes the return path
The method and structure described here identifies a means to bridge a current
return path discontinuity while maintaining the intended wire lengths. This method uses
a return path bridge on the same plane as the signal itself to cross the discontinuity. The
discontinuities are identified by either a visual inspection or a systematic
computer-automated review of the design file data. The method for identifying return
path discontinuities may be automated, and some of the discontinuities have methods
and structures for minimizing signal return paths by modifying the referenc...