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Highly Localized Non-Bonding Regions in Copper-to-Copper Bonded Stacked Wafers

IP.com Disclosure Number: IPCOM000032203D
Publication Date: 2004-Oct-26

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that creates localized insulating and conducting paths across bonded wafers or dies. Benefits include a solution that enables a signal and power routing layer in both the x and y directions.