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Reducing Wafer-to-Wafer Mean Thickness Variability on CVD Processes Using Novellus Vector Tools

IP.com Disclosure Number: IPCOM000032210D
Publication Date: 2004-Oct-26

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a multi-pedestal chamber to improve the wafer-to-wafer mean film thickness. The disclosed method accomplishes this by scaling a deposition parameter (i.e. pressure, RF power, gas flow, dep time, etc.) as a function of the number of wafers present in the process chamber. Benefits include improved control over process conditions.