Reducing Wafer-to-Wafer Mean Thickness Variability on CVD Processes Using Novellus Vector Tools
Publication Date: 2004-Oct-26
The IP.com Prior Art Database
Disclosed is a method that uses a multi-pedestal chamber to improve the wafer-to-wafer mean film thickness. The disclosed method accomplishes this by scaling a deposition parameter (i.e. pressure, RF power, gas flow, dep time, etc.) as a function of the number of wafers present in the process chamber. Benefits include improved control over process conditions.