Coefficient of Thermal Expansion Substrate Containing Negative Fillers for Die Package Thermal and Mechanical Stress Reduction
Publication Date: 2004-Oct-26
The IP.com Prior Art Database
Disclosed is a method that uses a functionally-graded low Coefficient of Thermal Expansion (CTE) organic substrate that contains inorganic fillers; these fillers have negative thermal expansion in the substrate core, and on the front side alternative build–up films (ABF). Benefits include reducing thermal and mechanical stresses.