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Coefficient of Thermal Expansion Substrate Containing Negative Fillers for Die Package Thermal and Mechanical Stress Reduction Disclosure Number: IPCOM000032218D
Publication Date: 2004-Oct-26

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Disclosed is a method that uses a functionally-graded low Coefficient of Thermal Expansion (CTE) organic substrate that contains inorganic fillers; these fillers have negative thermal expansion in the substrate core, and on the front side alternative build–up films (ABF). Benefits include reducing thermal and mechanical stresses.