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Disclosed is a method that uses an integrated spring-loaded BGA socket cover to reduce load on the package-to-board interconnect, and provide increased mechanical loads.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
61% of the total text.
An Integrated Spring-Loaded Socket Cover
for Reducing Mechanical Load on the BGA Socket Interconnect Systems
Disclosed is a method that uses an integrated spring-loaded
BGA socket cover to reduce load on the package-to-board interconnect, and
provide increased mechanical loads.
Mechanical loads and the temperature generated by a CPU and
surrounding mother board components can cause interruptions in electrical
functionality. These interruptions are caused by shorts in the eutectic socket
BGA joints. The current solution to this problem is limiting the mechanical
load applied by the heat sink (see Figure 1).
In the disclosed method, the integrated socket cover can
move vertically, and it incorporates four springs between the socket body and
the cover to maintain a small fixed gap (~0.025”) while in its unassembled
state. The cover has three sides that surround the socket body, and stand
0.025” away from the bottom plane of the solder spheres. This feature prevents
interference with the SMT assembly. Once the socket is mounted to the mother
board, the cover compresses with a small amount of force and makes contact with
the socket body during package assembly.
The three sides may also make contact with the board when the cover is
As the interconnect system (i.e. solder joints and the
socket contact mechanism) begins to creep under mechanical load and
temperature, the load is transferred through the socket cover, thereby reducing