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New Methodology for Modeling of Complicated Structures Found in High Performance Packaging Disclosure Number: IPCOM000032498D
Original Publication Date: 2004-Nov-08
Included in the Prior Art Database: 2004-Nov-08
Document File: 2 page(s) / 47K

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A novel technique is shown for assigning electrical properties to geometries defined in a mechanical CAD tool environment. A special algorithm was developed that uses color code information and is able to assign parameters such as dielectric constant, metal resistivity, node name, terminating resistance values and signal source amplitude to arbitrary shaped bodies that are defined in a CAD drawing tool. A unified graphical user interface is provided to design engineers to draw and define a structure, and also convert it to a format that can be directly used for modeling of the electromagnetic field response using powerful full-wave solvers.

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New Methodology for Modeling of Complicated Structures Found in High Performance Packaging

Today, complicated and arbitrary-shaped structures of models used in high performance packaging require sophisticated industrial computer aided design (CAD) tools to create such physical drawings. Due to the complexity and size of these drawings, it becomes a challenge to model these structures electrically. IBM* has developed a tool suite called electrical interconnect packaging (EIP) tools. These tools enable engineers to simulate 2D and 3D geometries using Maxwell's equations. These simulation results provide engineers with the design data necessary to optimize the electrical design and performance in computer systems. However, there is no existing method to directly translate a physical drawing into a text based input file which can be run in the EIP tools.

  Due to the complexity and size of these arbitrary-shaped structures being simulated, it becomes necessary to provide a new methodology to link the CAD tools and the EIP tools. This new methodology will provide a new user interface that will enable the user to assign electrical attributes to the structures (solid bodies) in the mechanical drawing within the CAD environment. In addition, this methodology will provide the user a mechanism for pulling only a subsection of the mechanical drawing into the electrical analysis. Alternatively, the user could choose to reduce the complexity of the structure to enable faster simulation by changing the output granularity of the structure in the CAD environment. It allows gathering the results of the EIP calculations and displaying them for analysis.

  The key to this new methodology involves the creation of an intermediate format, and a translation file. It also utilizes the color information to indirectly assign the attribute data to the structure. Finally, a conversion program that will utilize all the above information (color, geometry, and attribute) to create a text file to be used in the EIP tools. A unique algorithm for converting from color attributes to electrical properties.

  In order to assign the at...