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LCD Module SR film ramination on ACF for Bump stress

IP.com Disclosure Number: IPCOM000033077D
Original Publication Date: 2004-Nov-24
Included in the Prior Art Database: 2004-Nov-24

Publishing Venue

IBM

Abstract

Disclosed is a LCD module assembly device which withstands against shock kind of stress. The critical part is reinforced by design assembly technic then the LCD module withstands very hight stress.