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25x UPH Improve on Underfill Process for FCIP

IP.com Disclosure Number: IPCOM000033082D
Original Publication Date: 2004-Dec-25
Included in the Prior Art Database: 2004-Dec-25

Publishing Venue

Siemens

Related People

Other Related People:

Abstract

The core of the idea is to produce the Flip Chip In Package (FCIP) with through hole Printed Circuit Board (PCB) substrate using an existing underfill system but approximately 25 times the UPH (Units per Hour) (see Figure 2). For that, the UPH is improved by almost 25X using proven showerhead concept but with more control parameters. Each hole has a thin wall, which is located at the center of each package in pancake format. The underfill is dispensed from the backside of the substrate with the center hole at each package unit. In addition, there is an underfill flow on the die passivation rather than on the substrate's surface. So, there is no chance for the underfill to drip on the die backside. Snap UV (ultraviolet light) / IR (infrared light) cure is used to secure the filled shape before flip over the substrate.