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Wave Solder Stiffener Fence Design for BGA/FCBGA Packages

IP.com Disclosure Number: IPCOM000033136D
Publication Date: 2004-Nov-29

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a wave solder stiffener fence that uses the through hole solder joint to stiffen the BGA/FCBGA package. Benefits include minimizing board warpage and the risk of solder joint fractures.