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Method for prepatterned solid film UF with TCB

IP.com Disclosure Number: IPCOM000033147D
Publication Date: 2004-Nov-29
Document File: 4 page(s) / 105K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for prepatterned solid film underfill (UF) with thermocompression bonding (TCB). Benefits include improved functionality, improved performance, improved reliability, improved process simplification, and improved throughput.