Browse Prior Art Database

Thermal Solution using Nanowires

IP.com Disclosure Number: IPCOM000033152D
Original Publication Date: 2004-Nov-30
Included in the Prior Art Database: 2004-Nov-30

Publishing Venue

IBM

Abstract

A method is disclosed using nanowires to efficiently transfer heat from a component at higher temperature to a component at lower temperature. The approach demonstrates a thermal solution for future processors and ICs.