Method for thinning and shipping ultra thin wafers on conventional tooling.
Original Publication Date: 2004-Dec-16
Included in the Prior Art Database: 2004-Dec-16
The need for ultra thin wirebond wafers (100 um and below) is becoming more common. The mounting, dicing and picking of the ultra thin wafer is a challenge.There are a few methods to achieve this process ,one is a quartz carrier wafer method and another total integration from grind to dicing. The invention allows for the thinning,shipping ,transport ,mounting, dicing , and picking of the wafers (100 um and below) on common existing toolsets.