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Method for thinning and shipping ultra thin wafers on conventional tooling.

IP.com Disclosure Number: IPCOM000033547D
Original Publication Date: 2004-Dec-16
Included in the Prior Art Database: 2004-Dec-16

Publishing Venue

IBM

Abstract

The need for ultra thin wirebond wafers (100 um and below) is becoming more common. The mounting, dicing and picking of the ultra thin wafer is a challenge.There are a few methods to achieve this process ,one is a quartz carrier wafer method and another total integration from grind to dicing. The invention allows for the thinning,shipping ,transport ,mounting, dicing , and picking of the wafers (100 um and below) on common existing toolsets.