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Bevel cleaning using laser or ion beam

IP.com Disclosure Number: IPCOM000033548D
Original Publication Date: 2004-Dec-16
Included in the Prior Art Database: 2004-Dec-16

Publishing Venue

IBM

Abstract

Disclosed is a method for localized cleaning of the bevel and edge bead of silicon wafers by laser processing or ion beam processing. These techniques can be used to remove films in the bevel/edge bead, without damaging films in the device region.