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A Method of Making Wafer Carriers from Silicon Wafers for Dry Etching

IP.com Disclosure Number: IPCOM000033732D
Publication Date: 2004-Dec-23

Publishing Venue

The IP.com Prior Art Database

Abstract

Many semiconductor dry etching tools can etch silicon wafers in various sizes from 4 inches up to 12 inches. However, it requires changing some fixtures in the tool to fit different sizes of wafers. This is especially true for MEMS fabricators that are trying to apply their equipment for as many customers as possible. The changeover is very time consuming and increases the down time of the machine. This concept describes a method of making wafer carriers from larger silicon wafers for dry etching. For example, a 4-inch wafer can fit into a carrier that is made of a 6-inch wafer.