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Decoupling Capacities for High Density DIMMs

IP.com Disclosure Number: IPCOM000033750D
Original Publication Date: 2005-Jan-25
Included in the Prior Art Database: 2005-Jan-25

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Abstract

As the clock frequency and the power consumption of memory modules continue to increase, it is important that the modules provide lower supply impedance at higher frequency. The DIMM (Dual Inline Memory Module) power supply impedance depends especially on the decoupling caps matrix. Therefore, different types, values and sizes of capacitors must be used to optimize the PCB (Printed Circuit Board) performance. To have a good decoupling caps matrix, it is important to place the caps at the top and bottom edges of the PCB and also in-between the DRAMs (Dynamic Random Access Memories). Furthermore, it is advantageous to locate them as closely as possible to the DRAM power balls. Having the decoupling caps only on the top and bottom edges of the PCB is not sufficient to reduce the power supply impedance.