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Improving Thermal Performance of a DRAM Device When Packaged in a Multi-Die Stacked DRAM Package

IP.com Disclosure Number: IPCOM000033809D
Publication Date: 2004-Dec-28

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that improves the thermal performance of a DRAM device when packaged in a multi-die stacked DRAM package.