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Solder Bump Flattening During Electrical Testing

IP.com Disclosure Number: IPCOM000033852D
Publication Date: 2004-Dec-30

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses the pogo pins of the electrical test socket to flatten the solder bumps during electrical testing. Benefits include eliminating the need for an independent solder bump flattening process.