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High-Temperature Polymer Wafer Media for Processing Ultra Thin Wafers

IP.com Disclosure Number: IPCOM000033868D
Publication Date: 2004-Dec-30

Publishing Venue

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Disclosed is a method that uses a high-temperature polymer wafer media to process ultra thin wafers through a solder paste machine and a high-convection reflow oven. Benefits include a solution that safeguards the ultra thin wafers from scratches, cracks, and mishandling.