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Embedded PCB Module for High-Density, High-Speed Transmission

IP.com Disclosure Number: IPCOM000033870D
Publication Date: 2004-Dec-30

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that embeds higher performance materials and/or substrates into a conventional multilayer PCB. Benefits include being able to alter locally the electrical and mechanical properties of a PCB.