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A Restrainer Design and Force Definition for Substrate Warpage Control

IP.com Disclosure Number: IPCOM000033871D
Publication Date: 2004-Dec-30

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a restrainer clip with an optimized force to help reduce package co-planarity during the underfill epoxy cure process. Benefits include a solution that can be modified for a variety of packages.