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Wire Form Spring Clip for Heat Sink Attached to a Motherboard by Wave Soldering

IP.com Disclosure Number: IPCOM000034011D
Publication Date: 2005-Jan-11

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that attaches wire form clip for a IC heat sink by wave soldering the wire clip ends to the motherboard. Benefits include a solution that is more cost effective than the current state of the art.