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Innovative Concaved Substrate C4 Bump

IP.com Disclosure Number: IPCOM000034124D
Publication Date: 2005-Jan-17

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that introduces a concave shape to the substrate solder C4 bump. Benefits include reducing solder bridging and the die gap height as well as introducing mechanical hold of die. Possibility of eliminating or reduces UF usage.