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Carrier Drainage Geometry for Processing LGA Substrates

IP.com Disclosure Number: IPCOM000034125D
Publication Date: 2005-Jan-17

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a modified carrier ledge geometry that provides increased under board support for Land Grid Array (LGA) packages, while allowing for drainage through the Deflux operation. Benefits include a solution that eliminates costly secondary cleaning procedures.