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Chip Substrate Package with Pins as Second-Level Interconnects to Increase Second-Level I/O Count

IP.com Disclosure Number: IPCOM000034128D
Publication Date: 2005-Jan-17

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses pins as second-level interconnects on both sides of the flip chip substrate package, to increase second-level I/O counts and improve signals and power routing.