The following operators can be used to better focus your queries.
( ) , AND, OR, NOT, W/#
? single char wildcard, not at start
* multi char wildcard, not at start
(Cat? OR feline) AND NOT dog?
Cat? W/5 behavior
(Cat? OR feline) AND traits
Cat AND charact*
This guide provides a more detailed description of the syntax that is supported along with examples.
This search box also supports the look-up of an IP.com Digital Signature (also referred to as Fingerprint); enter the 72-, 48-, or 32-character code to retrieve details of the associated file or submission.
Concept Search - What can I type?
For a concept search, you can enter phrases, sentences, or full paragraphs in English. For example, copy and paste the abstract of a patent application or paragraphs from an article.
Concept search eliminates the need for complex Boolean syntax to inform retrieval. Our Semantic Gist engine uses advanced cognitive semantic analysis to extract the meaning of data. This reduces the chances of missing valuable information, that may result from traditional keyword searching.
Disclosed is a method that uses pins as second-level interconnects on both sides of the flip chip substrate package, to increase second-level I/O counts and improve signals and power routing.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
100% of the total text.
Chip Substrate Package with Pins as
Second-Level Interconnects to Increase Second-Level I/O Count
Disclosed is a method that uses pins as second-level
interconnects on both sides of the flip chip substrate package, to increase
second-level I/O counts and improve signals and power routing.
Currently, there is a limited
number of pins on the flip chip pin grid array (FC-PGA) packages (see Figure
1). This is compensated for by reducing the pin pitch, and by using pins with
Figure 2 shows the disclosed method in which the substrate has
both secondary-side and die-side pins, as compared to the current state of the
art which only has pins on the substrate secondary- side. Figure 3 shows the
cross section of the substrate build-up, with the copper traces connecting the
substrate bumps to the die-side pins, enabling faster routing of the signal from
the die to the mother board through the die-side pins. Figure 4 shows the
enabling portion, in which an additional socket on the die-side is connected to
the mother board through a flex cable connector.
The following are advantages of the disclosed method:
The number of pins can be increased, without the
need to shrink the pin pitch or use pins with smaller dimensions.
Pins on the die-side significantly improve
signal routing between die-side and the board.