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Serpentine Substrate Plating Bar for Matrix Array Packages

IP.com Disclosure Number: IPCOM000034132D
Publication Date: 2005-Jan-17

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses an improved substrate circuit design for the plating bar of the matrix array package (MAP). Benefits include a solution that enables the cost effective use of laser or water jet technologies.