Browse Prior Art Database

Yaw Assembly for Probing Modified Thermal Conduction Modules at Board Level in a Machine Environment

IP.com Disclosure Number: IPCOM000034180D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-26

Publishing Venue

IBM

Related People

Authors:
Gorman, RE Kozol, EJ Wright, JR [+details]

Abstract

This article describes a mechanism that automatically rotates a ground strap and fiber-optic bundle 180 degrees to provide contact of the ground strap to modified thermal conduction modules (TCMs). The drawing is a perspective view of the yaw assembly of this disclosure connected to a probe arm by means of a mounting bracket. The probe arm is attached to a precision "X-Y-Z" robotic-positioning system. A computer command, based on map data of the TCMs, will direct a rotary actuator to rotate 180 degrees. This will turn bevel gears which, in turn, will rotate a probe holder. With fiber-optic bundle, spring-loaded electrical probe, ground strap and pressure switch attached to the probe holder, as the robotic-positioning system moves in the "Z" direction, the electrical probe and ground strap will make contact with the TCM.