Browse Prior Art Database

Thin Film Module Disclosure Number: IPCOM000034181D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-27

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Related People

Chen, WT Katyl, RH Kresge, JS Seraphim, DP [+details]


The utilization of silicon chips in an electronic package requires electrical connection between the chip and its associated package. Typically, a module is used to fan out the tightly spaced chip connections to a grid that can interface with a card or board. One such method uses a metallized ceramic substrate as an interface between the silicon chip and a card/board second level carrier. There is a mismatch in expansion coefficient between the alumina ceramic and the silicon chip that inherently limits the size of the allowable chip controlled collapse chip connector (C-4) pattern. A thin film module (Fig. 1), which is described in the following, combines high reliability with good electrical and thermal performance in a surface mountable (vapor phase compatible) assembly.