Browse Prior Art Database

Thin Film Module

IP.com Disclosure Number: IPCOM000034181D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Chen, WT Katyl, RH Kresge, JS Seraphim, DP [+details]

Abstract

The utilization of silicon chips in an electronic package requires electrical connection between the chip and its associated package. Typically, a module is used to fan out the tightly spaced chip connections to a grid that can interface with a card or board. One such method uses a metallized ceramic substrate as an interface between the silicon chip and a card/board second level carrier. There is a mismatch in expansion coefficient between the alumina ceramic and the silicon chip that inherently limits the size of the allowable chip controlled collapse chip connector (C-4) pattern. A thin film module (Fig. 1), which is described in the following, combines high reliability with good electrical and thermal performance in a surface mountable (vapor phase compatible) assembly.