Fabrication of Injection Controlled Superconducting Links
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-27
Improved current density and more efficient cooling of the circuit line (link) of three terminal injection-controlled superconducting device, called a HOTPROP, is achieved by blanket depositing the link on the substrate instead of using lift-off processing over edge structure. (Image Omitted) Referring to Fig. 1a, link metallurgy 1, niobium nitride (or some other superconductor which exhibits combined high critical current and resistivity), is blanket deposited on a crystalline insulating substrate 2. An etch mask of aluminum is deposited after a resist pattern is formed via sub-micron lithography. The link is patterned by reactive ion etching (RIE) and the aluminum removed chemically afterward.