Browse Prior Art Database

Linear Solder Anvil Assembly

IP.com Disclosure Number: IPCOM000034189D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Carver, WF [+details]

Abstract

Disclosed is an assembly which is used to remove excess solder off 12 mm Metallized Ceramic Flush Pin Substrates using the Impact Tinning process. This assembly is a linear-driven solder anvil, replacing the rotary driven anvil that was built to begin the program. A straight cylinder 1 is used to bring the anvil 5 to the "hit" position from the "home" position. By using the straight cylinder, it puts the anvil in the same position every time for the tinning racks to hit against. It eliminates the requirement that the operator make numerous alignment adjustments to the assembly to keep it in the right position for the tinning racks to hit against. The straight cylinder is magnetic, which allows the position switches 2 to be activated by the magnet in the cylinder.